Comportement anodique d’alliages or-cuivre en solution aqueuse de NaCl

Authors

  • P. Tissot Laboratoire de Chimie et Electrochimie Appliquées de l’Université de Genève, CH-1211 Genève 4
  • H. Lüthy Laboratoire de Chimie et Electrochimie Appliquées de l’Université de Genève, CH-1211 Genève 4
  • R. Monnier Laboratoire de Chimie et Electrochimie Appliquées de l’Université de Genève, CH-1211 Genève 4

DOI:

https://doi.org/10.2533/chimia.1973.15

Abstract

The anodical behaviors of 50% Cu-Au alloys, having an ordered or disordered structure, were studied in aqueous solutions of chloride by means of different electrochemical methods.

The corrosion products were examined by electron microprobe analyser. The anodic corrosion of the alloys seems to proceed with a dissolution of gold and copper followed by redeposition of gold on the surface of the electrode. The following mechanism is proposed :

Cu + 2 Cl- = CuCl2 + e (dissolution of Cu)
Au + 4 Cl- = AuCl4- + 3 e (dissolution of Au)
AuCl4-  + 3 CuCl2 = Au + 3 Cu++ + 10 Cl- (re-deposition of Au)

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Published

1973-01-31

Issue

Vol. 27 No. 1 (1973): Forschung/Research

Section

Kurze Mitteilungen

License

Copyright (c) 1973 P. Tissot

Creative Commons License

This work is licensed under a Creative Commons Attribution 4.0 International License.

How to Cite

[1]
P. Tissot, H. Lüthy, R. Monnier, Chimia 1973, 27, 15, DOI: 10.2533/chimia.1973.15.